Our lasers Rondo


Laser Series

Rondo Laser series is a range of powerful industrial nanosecond lasers offering output power up to 200W and pulse energies in excess of 250µJ, with pulses shorter than 50 ns.
Based on our proprietary technology (Taranis Single Crystal Fiber), Rondo 4223 laser is designed for high repetition rate up to 500 kHz. Rondo 3720 laser is based on NdYVO4 amplifier technology to deliver high output of 100W at an affordable price. All these unique architectures provide excellent reliability and beam quality, all in a compact packaging.

The short pulse-widths, high energy and high power combined with all other features (PSO, Burst, UV option) enable to achieve cost-efficient industrial processes.

Download Datasheet

NANO SNAP SHOT


• Pulse width less than 50 ns
• Output Repetition Rate: Single Shot to 500 KHz
• Beam quality M²<1.5
• Pulse energy up to 250μJ in UV
• Fast warm up (30 minutes max)
• Power stability < 3% RMS
• Position Synchronized Output (PSO) Friendly
• BURST Mode Friendly

 

Specications


 

Rondo 3720 Rondo 4223
Average Power 100W (IR) / 25W (uv) @ 100kHz 180W (IR) / 38W (uv) @ 300kHz
Repetition Rate 50-150 kHz 300-500 kHz
Pulse Energy* 250 µJ 126 µJ
Average Power Stability < 3%
Center wavelength 1064 nm / 355 nm 1030 nm / 343 nm
PER > 20dB
Spatial Mode TEM00
Pulse Width < 50 ns < 20 ns
Beam diameter 3 mm ± 10%
Beam divergence 0.5 mrad
Beam Ellipticity ≥ 0.9
Beam Quality (X/Y) M² < 1.5 M² < 1.3
Warm-up time < 30 min
Laser Dimensions***(l x L x h) 926 x 330 x 200mm 858 x 459.5 x 187.4 mm
Laser Weight**** 60 kg 60 kg
Power Supply Dimensions***(l x L x h) 625.5 x 482.6 x 102 mm 805 x 550 x 900 mm
Power Supply Weight 20 kg 70 kg

* Pulse Energy in UV

Mechanical data


RONDO 3720

RONDO 4223

APPLICATIONS


• Via Hole Drilling
• IC Trimming
• Wafer and solar cell Scribing
• PCB Cutting
• Flexible PCB cutting
• 5G LCP Processing
• Hight Speed Marking
• Glass Drilling
• Wafer Planarization
• SIP Cutting
• Ceramics cutting and drilling
• Lithium battery Foil cutting